15.03.2006 13:02:00
|
ZSP Expands VoIP Solutions With Z.Voice SoC Sub-System and VoWiFi With AEC
VON CONFERENCE, SAN JOSE, Calif., March 15 /PRNewswire-FirstCall/ -- The ZSP(R) business unit of LSI Logic Corporation today announced the addition of the Z.Voice(TM) System-on-Chip (SoC) Voice-over-IP (VoIP) licensable sub-system and Z.Voice-VoWiFi with AEC to its portfolio of VoIP solutions. The Z.Voice VoIP sub-system offers an integrated solution in broadband access for applications such as IP phones and CPE gateway devices. The Z.Voice-VoWiFi software solution enables faster time-to-market for implementing voice over Wireless LAN.
Combined with the ZSP410 licensable digital signal processor (DSP) core, the Z.Voice SoC sub-system provides a system solution at a silicon level. With its integrated design and software VoIP sub-system, customers can implement this solution as a blackbox, with no need to program the DSP. Cell phone designers who plan to add VoIP at the chip level can apply the SoC sub-system along with the Z.Voice VoWiFi integrated software to enable VoIP functionality in their handset designs. These products support the popular VoIP codecs* such as G.711 with PLC, G.729AB, G.723.1. The ZSP unit also offers the full range of G.729, G.728 and GSM codecs and is working with third party partners to support wideband codecs including G.722.2 for enhanced voice quality and iLBC for instant messaging based VoIP
"By combining our rich portfolio of embeddable ZSP cores and standard products, technology expertise and reference designs, we're able to develop next-generation silicon-to-system solutions for emerging markets such as voice over WiFi in Dual-mode cell phones," said Ramesh Bhimarao, product line manager for voice segment. "We provide all the necessary elements for designers to develop innovative, cost-effective VoIP products that meet customer demand and performance."
Availability
The Z.Voice-VoWiFi solution is available now. The Z.Voice SoC VoIP sub-system is available immediately to qualified customers. Both solutions will be demonstrated at the Spring VON Conference in San Jose, March 14-17, 2006, booth 1436.
* Products implementing certain standards may be subject to third party patent rights. The purchase of such products does not, by itself, convey a license or right under the third party patents. Purchaser must obtain a separate license from the appropriate patent owner.
About LSI Logic Corporation
LSI Logic Corporation is a leading provider of silicon-to-system solutions that are used at the core of products that create, move and store digital information. LSI offers a broad portfolio of capabilities including custom and standard product ICs, host bus and RAID adapters, storage area network solutions and software applications. LSI products enable leading technology companies in the Consumer, Communications and Storage markets to deliver some of the most advanced and well-known electronic systems in the market today. More information is available at http://www.lsi.com/.
Notes to Editor:
1. All LSI Logic news releases (financial, acquisitions, manufacturing, products, technology etc.) are issued exclusively by PR Newswire and are immediately thereafter posted on the company's external website, http://www.lsilogic.com/.
2. LSI Logic, the LSI Logic logo, ZSP and Z.Voice are trademarks or registered trademarks of LSI Logic Corporation.
3. Please do not assign a Reader Service number to this release.
Wenn Sie mehr über das Thema Aktien erfahren wollen, finden Sie in unserem Ratgeber viele interessante Artikel dazu!
Jetzt informieren!
Nachrichten zu LSI Corporation Cash Settlement At USD 11.15 A Shmehr Nachrichten
Keine Nachrichten verfügbar. |
Analysen zu LSI Corporation Cash Settlement At USD 11.15 A Shmehr Analysen
Indizes in diesem Artikel
S&P 500 | 5 996,66 | 1,00% |