Rudolph Ships JetStep Lithography System To OSAT Facility - Quick Facts

(RTTNews) - Rudolph Technologies, Inc. (RTEC) said it has shipped the JetStep Advanced Packaging Lithography System to an outsourced assembly and test or OSAT facility. The company noted that the new customer will use the JetStep W Series for fan-out wafer level packaging or FO-WLP applications.

Rudolph's JetStep Advanced Packaging Lithography Systems are specifically designed to meet the challenges of newly-developed processes now emerging in back-end manufacturing.

The JetStep W Series is intended for use with wafers or other round substrates, while the JetStep S Series is for square or rectangular substrates.