Tessera Inks New Patent License Agreements With Samsung

(RTTNews) - Tessera Technologies, Inc. (TSRA) and Samsung Electronics Co., Ltd. (SSNNF.PK, SSNLF.PK) Tuesday said that Tessera's subsidiaries Tessera, Inc. and Invensas Corp. have entered into new patent license agreements with Samsung.

Tessera said its semiconductor packaging portfolio continues to be used by many leading companies, and Invensas continues to license its semiconductor and semiconductor packaging portfolio. At the same time, it is innovating with next generation packaging solutions like its multi-die face down, Bond Via Array and 3D IC packaging solutions.

Tae-Gyeong Chung, senior vice president and head of semiconductor packaging, Samsung, said, "Samsung is delighted to have expanded our existing relationship with Tessera, Inc. and established a new relationship with Invensas. Beyond patent licenses, we look forward to working with Invensas and exploring the potential benefits of its current and future technologies."

The specific terms and conditions of the agreements were kept confidential.