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30.09.2025 07:30:03

First AIXTRON CCS MOCVD system for Scandium and Yttrium materials installed at Cornell University


EQS-Media / 30.09.2025 / 07:30 CET/CEST

First AIXTRON CCS MOCVD system for Scandium and Yttrium materials installed at Cornell University

 

Herzogenrath, September 30, 2025 – Cornell University in Ithaca, New York, has purchased a state-of-the-art Close Coupled Showerhead® (CCS) Metal-Organic Chemical Vapor Deposition (MOCVD) system from AIXTRON SE (FSE: AIXA). The new tool will strengthen Cornell’s Materials Science Department and significantly expand its capabilities to research and develop advanced Scandium- and Yttrium-containing materials with promising applications in next-generation electronics.

 

Cornell’s acquisition is the university’s first AIXTRON CCS MOCVD installation and represents an impactful upgrade to its research infrastructure. The CCS system enables deposition of high-quality, highly uniform thin films—an essential capability for pioneering materials research and for translating laboratory findings into devices. In particular, small incorporations of Scandium (Sc) or Yttrium (Y) into certain material systems can markedly enhance piezoelectric properties. First research reports indicate that only a few percent Sc can increase the piezoelectric coefficient by multiple times, enabling higher current densities or operation at higher frequencies in advanced devices. Yttrium similarly plays a crucial role in tailoring electronic and ferroelectric properties for power-efficient and high-performance components.

 

What makes this CCS MOCVD tool unique is its capability to handle low-vapor-pressure precursors while enabling process conditions that support higher partial pressures of Scandium during key barrier and active-layer growth steps. For this installation, the tool will be equipped with a newly developed high-temperature source and optimized precursor handling that allow for stable, controllable Sc and Y incorporation without compromising film uniformity. These features permit researchers to explore materials and device designs that were previously difficult to achieve, bridging scientific discovery with scalable process conditions.

 

“We are incredibly excited to integrate AIXTRON’s CCS MOCVD tool into the Materials Science Department,” said Prof. Hari Nair, Assistant Professor in the Materials Science Department at Cornell University. “This acquisition represents a major step forward in our commitment to pioneering research. The ability to deposit low-vapor-pressure precursors such as Scandium and Yttrium under controlled, high-partial-pressure conditions opens up new pathways for improving piezoelectric and ferroelectric performance — properties that are highly desirable for next-generation power-efficient and high-frequency devices.”

“We are proud to support Cornell University’s Materials Science Department with our CCS MOCVD technology,” said Dr. Felix Grawert, CEO of AIXTRON SE. “Our systems are engineered to meet the demanding conditions required for emerging materials research. The bespoke high-temperature source and advanced precursor management for this tool demonstrate AIXTRON’s commitment to enabling new material chemistries and to translating laboratory innovation into industrially relevant processes.”

 

Cornell’s acquisition of the CCS MOCVD system represents a significant milestone in the university’s pursuit of research excellence. The university looks forward to the discoveries, device demonstrations and cross-disciplinary collaborations that this tool will enable, including partnerships with industry and academic institutions worldwide.

 

 

 

Contact

 

Christian Ludwig

Vice President Investor Relations & Corporate Communications

fon +49 (2407) 9030-444

e-mail c.ludwig@aixtron.com

 

 

About AIXTRON:

AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States, and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications.

 

Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level SolutionS®, Close Coupled Showerhead®, CRIUS®, Gas Foil Rotation®, OVPD®, Planetary Reactor®, PVPD®, TriJet®

For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com.

 

 

Forward-Looking Statements

This document may contain forward-looking statements regarding the business, results of operations, financial condition, and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance, or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semiconductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law. 

 

This document is also available in a German language translation version. In case of discrepancies, the English language document shall prevail and shall be the valid version.



End of Media Release


Issuer: AIXTRON SE
Key word(s): Enterprise

30.09.2025 CET/CEST Dissemination of a Press Release, transmitted by EQS News - a service of EQS Group.
The issuer is solely responsible for the content of this announcement.

The EQS Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
Archive at www.eqs-news.com


Language: English
Company: AIXTRON SE
Dornkaulstraße 2
52134 Herzogenrath
Germany
Phone: +49 (2407) 9030-0
Fax: +49 (2407) 9030-445
E-mail: invest@aixtron.com
Internet: www.aixtron.com
ISIN: DE000A0WMPJ6
WKN: A0WMPJ
Indices: MDAX, TecDAX
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange; Nasdaq OTC
EQS News ID: 2203994

 
End of News EQS Media

2203994  30.09.2025 CET/CEST

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