Press Release: LOQTEQ(R): Granted US patent extends aap's IP-family / No case of cold welding observed

aap Implantate AG / LOQTEQ(R): Granted US patent extends aap's IP-family / No case of cold welding observed . Processed and transmitted by Nasdaq OMX Corporate Solutions. The issuer is solely responsible for the content of this announcement.

aap reports that the US patent and trademark office has granted another patent extending the LOQTEQ(R) IP-family through publication of a notice of allowance. The LOQTEQ(R) technology is based on an IP-family, consisting of patents that are granted in Europe and the US. Additional patents in both regions are still pending. This notice supports the extension of the IP-based LOQTEQ(R) portfolio.

With the launch of LOQTEQ(R) aap has been conducting a post market follow-up study with over 150 patients aiming at validating the advantage of LOQTEQ(R) with regard to reduce cold welding. One of the problems with titanium locking plates is the removal of screws during explantation, often attributable to cold welding of screw heads into the threads of the locking screw holes. Difficulties in removing such kind of trauma implants are related to time-consuming surgical procedures as well substantial risk exposures regarding patient safety. Risks of implant removal include wound-healing problems, neurovascular injury, failure to remove all of the implant and refracture. aap's LOQTEQ(R) technology is based on unique design features which are supposed to address adequately this clinical issue.

aap presented today some of the results of this study during the EFORT Congress (European Federation of National Associations of Orthopaedics and Traumatology) in London to a broad audience. The results show that so far there has been no observation of a cold welding case with the LOQTEQ(R) plates and screws. aap continues the study with additional patients until the end of 2014.

Both, the granted US patent and the results of the study, underline our strategic imperative of value-based innovations that combine clinical and economic benefits with features such as simple handling, easy implantation and removal, reduced patient risks and the saving of healthcare costs.

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About aap Implantate AG

aap is a global medical device company headquartered in Berlin, Germany that develops, manufactures and markets innovative biomaterials and implants that are used in orthopedic procedures. The Company's products, which include a full line of plating systems, cannulated screws and bone cement products, are primarily used in the orthopedic specialty areas of trauma and spine repair. The Company's products are sold through its direct sales force, distribution partners and license agreements with OEM partners. aap's stock is listed in the Prime Standard segment of the Frankfurt Stock Exchange. For more information, please visit www.aap.de, or download the Company's investor relations app from the Apple's App Store or Google Play.

Forward-looking statement

This release may contain forward-looking statements based on current experience, estimates and projections of the management board and currently available information. They are not guarantees of future performance. Various known and unknown risks, uncertainties and other factors could lead to material differences between the actual future results, financial situation, development or performance of the company and the estimates given here. Many factors could cause the actual results, performance or achievements of aap to be materially different from those that may be expressed or implied by such statements. These factors include those discussed in aap's public reports. Forward-looking statements therefore speak only as of the date they are made. aap does not assume any obligation to update the forward-looking statements contained in this release or to conform them to future events or developments.

For inquiries please contact: aap Implantate AG, Marc Heydrich, Investor Relations, Lorenzweg 5, 12099 Berlin, Germany

Tel.: +49 30 7501 9-134, fax: +49 30 7501 9-290, e-mail: m.heydrich@aap.de

This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.

The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.

Source: aap Implantate AG via Globenewswire

HUG#1790822

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aap Implantate AG

Lorenzweg 5 Berlin Germany

WKN: 506660;ISIN: DE0005066609;

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   June 04, 2014 14:34 ET (18:34 GMT)- - 02 34 PM EDT 06-04-14